Created in the university of Tokyo this humanoid robot is notable, foremost, that can stand up from position lying to somersault and sit down. At implementation of these motions a machine reminds a man indeed vividly.
That seems elementary for a man, a 60-kilogram humanoid is not so simple to do: huge number of sensors is used in the system, including gyroscopes and accelerometrs.
Intel:
In the second half of 2007, Intel will begin production of the next generation Intel® Core™2 processor family codenamed “Penryn” which is based on our industry-leading 45-nanometer (nm) Hi-k metal gate process technology and latest microarchitecture enhancements. This next evolution in Intel® Core™ microarchitecture builds on the tremendous success of our revolutionary microarchitecture (currently used in both the Intel® Xeon® and Intel® Core™2 processor families) and marks the next step in Intel’s rapid cadence for delivering a new process technology with an enhanced microarchitecture or an entirely new microarchitecture every year.
he Penryn family adds to the Intel Core 2 processor family:
A second-generation quad-core desktop processor with up to 12MB L2 cache
A new dual-core desktop processors with up to 6MB shared L2 cache
A new low-power dual-core mobile processor with up to 6MB shared L2 cache and a new low-power state that substantially lowers processor idle power
The Penryn family also adds several new processors to the Intel Xeon processor family:
A second-generation quad-core dual-processing (DP) server/workstation processor with up to 12 MB L2 cache
A dual-core DP processor with 6MB shared L2 cache
A multi-processing (MP) quad-core processor currently under development
The Penryn family, with its 45nm Hi-k silicon technology, is the latest “tick” and includes many microarchitecture innovations to Intel Core microarchitecture. Coming in 2008 is the following “tock,” Intel’s next brand new microarchitecture codenamed “Nehalem.”
Nehalem is a truly dynamic- and design-scalable microarchitecture. It will deliver both performance on demand and optimal price/performance/energy efficiency for each platform.
Nehalem’s dynamic scalability includes:
Dynamically managed cores, threads, cache, interfaces, and power
Leveraging leading 4 instruction issue Intel Core microarchitecture technology (Intel Core microarchitecture’s ability to process up to 4 instructions per clock cycle on a sustained basis as compared to 3 instructions per clock cycle or less for other processors)
Simultaneous multi-threading (Intel Hyper-Threading Technology) to enhance performance and energy efficiency
Innovative new Intel® SSE4 and ATA instruction set architecture additions
Superior multi-level shared cache that leverages Intel® Smart Cache technology
Sony will refresh its notebook PC line in July with a new 15.4-inch, 13.3-inch and 11.1-inch widescreen VAIO FZ, VAIO SZ5 and VAIO TZ series, according to forum members on NotebookReview web site. In addition, a widescreen 14-inch VAIO CR laptop and another 13.3-inch widescreen series - CZ - are rumored to come out at the same time.
The specifications summaries of forthcoming Sony VAIO notebooks indicate that FZ series will feature Intel’s next generation “Santa Rosa” platform and the new Core 2 Duo “Merom” processors, a 2GB of main memory, and up to 200GB hard drive.
Sony VAIO SZ5 series will feature current Core 2 Duos, 2GB of RAM and up to 200GB HDD, while the ultra-portable TZ laptops will be powered by Core 2 Duo ultra-low voltage CPUs.
All of these VAIO notebooks will have an integrated web camera.
There are no specifications of the VAIO CR and VAIO CZ available.
www.laptoping.com: Lexar Media, Inc., a manufacturer of NAND flash memory products, announced its new ExpressCard SSD (solid-state drive) with auto-backup software.
“Roughly half the size of current PC Card solutions, the Lexar ExpressCard SSD is a high-capacity removable solid state drive that promises to set a new standard for delivering high-performance, lower-cost storage expansion to notebook computers. The Lexar ExpressCard SSD comes bundled with auto-backup software, an innovative solution for protecting laptop computer files and data that allows for automatic regular (daily, weekly, or monthly) backup without user intervention after the initial setup,”
The Lexar ExpressCard SSD, which comes with 4GB, 8GB, and 16GB capacities,
is also Windows Vista ReadyBoost compatible.
AMD announced its new Turion 64 X2 processors, based on 65nm silicon-on-insulator technology. The new dual core 64-bit notebook CPUs, will replace the current 90nm Turions. Although AMD did not provide the details of new chips, the 65nm units should bring better performance and lower power consumption than 90nm processors.
According to earlier reports, the new AMD Turion 64 X2 lineup includes the TL-66 model running at 2.3GHz, which is the fastest Turion processor.
AMD says its 65nm dual core mobile CPUs are now shipping to computer manufacturers, while the notebook PCs based on the new chips will be available later this quarter in designs from leading computer manufacturers.
www.laptoping.com: Asus is preparing G1S and G2S, its new gaming notebooks based on Intel “Santa Rosa” notebook platform and powered by Intel Core 2 Duo processors and new DirectX 10-ready nVidia GeForce 8600M 256MB video cards.
The 15.4-inch (1680×1080) widescreen G1S and 17-inch (1920×1200) widescreen G2S feature 2GB of main memory, 160GB and 200GB hard drives respectively, DVD burners, Gigabit Ethernet, Wireless and Bluetooth connections.
Asus G1S and G2S laptops, which are the refreshed G1 and G2 models, are expected to cost €1700 and €1900 ($2300 and $2560) respectively. The new gaming notebooks will be available in Europe starting from May 21. Currently, there is no information on their availability in the United States.
Notebooks featuring widescreen 3D LCD displays, which are capable of conveying three-dimensional images to the viewer, are likely to hit the market in 2007 or 2008, DigiTimes reports.
According to Taiwan-based panel makers, US-based notebook vendors are aggressively seeking for 3D LCD panel solution from Taiwan.
“Although using 3D panels for notebooks will reduce brightness and increase power consumption of the notebooks while it will require new software and solution, the US-based notebook vendors are still interested in the market for game users,” the report says.